Four disciplines. One team. No handoffs.
Electronics, firmware, mechanical integration and the software a connected product ships with are decided together, so the trade-offs between them are made deliberately rather than discovered at integration.
Capability
01
Electronics Design
Schematic capture, multilayer layout, signal integrity review and DFM.
Read more →02Firmware Development
Bare-metal and RTOS firmware, drivers, wireless stacks and update paths.
Read more →03Mechanical Design
Enclosure design, board-to-housing fit, thermal strategy and production CAD.
Read more →04Software Development
AWS cloud backends, and web and mobile companion apps for connected hardware.
Read more →How we work
Six stages, each with a named deliverable.
01
Scope
Requirements
02
Architect
Block diagram
03
Design
Schematics, layout
04
Prototype
Built boards
05
Validate
Test report
06
Transfer
Production pack